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Five main methods for making circuit boards
Oct 17,2024
1. Copper plate corrosion method
Copper plate corrosion method is a low-cost but relatively complex method for manufacturing circuit boards. The basic steps include:
Cutting copper-clad laminates: Cut the copper-clad laminates to the appropriate size according to the circuit diagram requirements.
Pre treatment: Use fine sandpaper to polish the surface of the copper-clad board, remove the oxide layer, and ensure that the carbon powder can firmly adhere during transfer printing.
Transfer printing circuit board: Use transfer paper to transfer the circuit pattern onto a copper-clad board, and firmly attach the carbon powder by heating.
Corrosion circuit board: Place the transferred copper-clad board into a corrosion solution to remove the copper layer that is not protected by carbon powder, forming a circuit.
Cleaning and Drilling: Clean the corroded circuit board, remove residual corrosive solution and carbon powder, and drill holes on the circuit board as needed.
2. Heat transfer printing method
The heat transfer printing method has the advantages of high precision and suitability for complex circuit design, but the equipment and consumables costs are relatively high. The steps are as follows:
Printing circuit patterns: Use a laser printer to print circuit patterns (mirror images) on thermal transfer paper.
Heat transfer printing: The heat transfer paper is attached to a copper-clad laminate and heated by a heat transfer machine to transfer the circuit pattern onto the copper foil.
Corrosion and Cleaning: Use chemical methods to remove unwanted copper foil and clean circuit boards.
3. Inkjet printing method
The inkjet printing method is simple and easy to implement, suitable for the production of simple single-sided circuit boards. The steps include:
Printing circuit patterns: Use an inkjet printer to print circuit patterns on a substrate coated with special ink.
Corrosion: Copper powder in ink forms circuits during chemical corrosion.
4. Sensitive photochemical method
The sensitive bright light method is also applicable to complex double-sided circuit board designs, but at a higher cost. The process includes:
Making a photosensitive circuit board: The circuit pattern is made on a transparent film according to the design.
UV exposure: transferring patterns onto a photosensitive circuit board through UV exposure.
Corrosion and Cleaning: Remove unwanted copper foil and clean the circuit board.
5. Wax paper method
The wax paper method has low cost but low accuracy, making it suitable for simple single-sided circuit board production. The steps are:
Engraving wax paper: Engrave the circuit diagram on wax paper and cut it according to the size of the circuit board.
Printed circuit board: Place wax paper on the copper-clad board, apply printing material evenly, and print the circuit board.
Corrosion and cleaning: Use corrosive solution to remove copper foil that is not protected by wax paper, and clean the circuit board.
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