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  • X-Ray-无损透视检测仪.jpg

X-ray non-destructive perspective testing instrument


Category:

Equipment


Equipment brand: Elantra Technology

Detailed


Equipment type: X-Ray non-destructive perspective testing instrument

Equipment brand: Elantra Technology

Equipment model: TH100

Test types: BGA, CSP, Chip, etc

Pixel matrix: 1536x1536

System magnification: 1300 times

Specification size: 1285 * 1748 * 1100mm

Equipment weight: approximately 1500kg

Power supply mode: AC110-230VAC, 50/60Hz

3D AOI

Equipment model: TU880DL

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Reflow soldering

Cooling method: Three cooling zones: forced air cooling/water cooling

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High Speed Chip Mounter

Mounting speed: 40000 cph

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High Speed Chip Mounter

Equipment model: 471PLUS

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