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High Speed Chip Mounter


Category:

Equipment


Mounting speed: 40000 cph

Detailed


Device brand: Samsung

Equipment model: 471PLUS

Mounting speed: 40000 cph

SMT precision: ± 40um

Mountable component size: 0603 chip~L42mm × W42mm (diagonal 152) × T15mm

Mounting substrate size (mm): 50 (L) * 50 (W)~510 (L) * 460 (W)

Equipment size: W 1680 mm × L 1650 mm × H 1530 mm

Power supply: 380V

3D AOI

Equipment model: TU880DL

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Reflow soldering

Cooling method: Three cooling zones: forced air cooling/water cooling

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High Speed Chip Mounter

Mounting speed: 40000 cph

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High Speed Chip Mounter

Equipment model: 471PLUS

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